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| Features 0402 and 0603 package options Rated for IEC 61000-4-2, level 4 Withstands multiple ESD strikes Low capacitance and leakage currents for invisible load protection Tape and reel packaging Chip Guard(R) MLD Series Varistor ESD Clamp Protectors Description The Chip Guard(R) CG0402MLD and CG0603MLD Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLD family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications targeted for high speed data applications. The Chip Guard(R) MLD Series has been manufactured to provide very low cpacitance with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics @ 25 C (unless otherwise noted) Continuous Operating Voltage Model VDC (V) Max. CG0402MLD-12G CG0603MLD-12E 12 12 Breakdown Voltage VB @ 1 mA (V) Typ. 50 ~ 60 50 ~ 60 Clamping Voltage VC @ 1 A 8/20 s (V) Max. 140 140 Off-state Current IL (A) Max. 1 1 Capacitance COFF (pF) Max. 5 5 Environmental Characteristics Operating Temperature..................................................................................-30 C to +85 C Storage Temperature ....................................................................................-30 C to +85 C Standard ..............................................................................................IEC 61000-4-2 Level 4 Device Symbol V How to Order Surge Withstand Ratings Parameter ESD Voltage Capability, Contact Discharge ESD Voltage Capability, Air Discharge Standard Peak Voltage 8 kV 15 kV Repetitions (Min.) 100 at 8 kV 100 at 15 kV CG 0603 MLD - 12 E Chip Guard(R) Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 12 = 12 V Tape & Reel Packaging E = 4,000 pcs. per reel (CG0603MLD Series) G = 10,000 pcs. per reel (CG0402MLD Series) Ni barrier terminations are standard on all Chip Guard(R) part numbers. IEC61000-4-2 Level 4 Reliable Electronic Solutions Asia-Pacific: TEL +886-2 25624117 * FAX +886-2 25624116 Europe: TEL +41-41 7685555 * FAX +41-41 7685510 North America: TEL +1-909 781-5500 * FAX +1-909 781-5700 TEL +1-951 781-5500 * FAX +1-951 781-5700 (after 7/17/04) www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Chip Guard(R) MLD Series Varistor ESD Clamp Protectors Product Dimensions A W Recommended Pad Layout A L B DIMENSIONS = MM (INCHES) C D B Dimension L W A B CG0402MLD Series 1.00 0.15 (0.04 0.006) 0.50 0.10 (0.02 0.004) 0.50 0.10 (0.02 0.004) 0.25 0.15 (0.010 0.006) CG0603MLD Series 1.60 0.20 (0.064 0.008) 0.80 0.20 (0.032 0.008) 0.80 0.20 (0.032 0.008) 0.30 0.20 (0.012 0.008) Dim. A B C D CG0402MLD Series 0.51 (0.020) 0.61 (0.024) 0.51 (0.020) 1.70 (0.067) CG0603MLD Series 0.76 (0.030) 1.02 (0.040) 0.50 (0.020) 2.54 (0.100) Solder Reflow Recommendations 300 250 200 150 100 50 0 110 sec. (min.) 30-70 sec. Time (seconds) 120 sec. (min.) Preheat Stages 1-3 Soldering Cooling A B C D Stage 1 Preheat Ambient to Preheating 30 s to 60 s Temperature Stage 2 Preheat 140 C to 160 C Stage 3 Preheat Preheat to 200 C Main Heating 200 210 220 230 240 C C C C C 60 s to 120 s 20 s to 40 s 60 55 50 40 30 s s s s s to to to to to 70 65 60 50 40 s s s s s Temperature (C) E Cooling 200 C to 100 C 1 C/s to 4 C/s * * * * This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Chip Guard(R) MLD Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 1.0 (0.52 0.04) 8.00 0.30 (0.32 0.012) 4.00 0.10 (0.16 0.004) C 1.50 0.10 (0.06 0.004) 2.0 0.50 (0.08 0.02) 62.0 1.50 (2.48 0.06) 13.0 0.50 (0.52 0.02) L TOP TAPE W G D 3.50 0.05 (0.14 0.002) 21.0 0.80 (0.84 0.032) 180.8 2.0 (7.12 0.08) NOTES: TAPE MATERIAL IS PAPER. 0.60 0.05 TAPE THICKNESS IS (0.024 0.002) COVER TAPE ADHESION IS 40 15 GRAMS. 9.0 0.50 (0.36 0.02) Dimension C D L W G CG0402MLD Series 1.75 0.05 (0.04 0.002) 2.00 0.02 (0.08 0.0008) 1.12 0.03 (0.045 0.0012) 0.62 0.03 (0.025 0.0012) 2.0 0.05 (0.08 0.002) CG0603MLD Series 1.75 0.10 (0.04 0.004) 2.00 0.05 (0.08 0.002) 1.80 0.20 (0.072 0.008) 0.90 0.20 (0.036 0.008) REV. A 02/04 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. "Chip Guard" is a registered trademark of Bourns, Inc. COPYRIGHT (c) 2004, BOURNS, INC. LITHO IN U.S.A. E 02/04/CG0401 |
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